Selective Soldering Machine | Select Integra 508-5S Get latest price

Available in four variants, the Integra™ 508.5 features concurrent fluxing, preheating and soldering and can be configured with two or three in-line soldering stations for maximum output.

Product Benefits: 

• Versatility: With its flexible configuration, the Integra™ 508.5 is a versatile selective soldering platform and can be equipped for either single, parallel or double processing. Use of a single dropjet fluxer and solder pot allows soldering of printed circuit boards as large as 508 x 508 mm (20.0 x 20.0 in.).
• Integra 508.5 2S Configuration: When configured with dual drop-jet fluxers and dual solder pots, the Integra™ 508.5 can be used in two different modes and is capable of processing up to 10 boards at one time. The parallel processing mode enables fluxing and soldering of two printed circuit boards in each fluxing and soldering station at the same time doubling machine productivity.
• Value: With a reputation for innovation, comprehensive process solutions from Nordson SELECT ensure a maximum return on investment and low cost of ownership. From initial process development through full-scale production, you are supported by our experienced worldwide engineering, applications development and technical service network.

Product Features:

• Five-zone operation with independent zone for concurrent fluxing and preheating plus either two (508.5 2S) or three selective soldering stations (508.5 3S)
• SMEMA chain conveyor with positive PCB location
• Automatic conveyor width adjustment
• MicroDrop drop-jet fluxer
• Flux level sensing system
• Full surface bottom-side infrared preheating
• All titanium solder pot and pump assembly
• Quick change magnetically coupled solder nozzle
• Automatic solder pot level monitoring
• Automatic wave height monitoring
• Heated nitrogen inerting system
• Process viewing camera
• PhotoScan editor and machine control software
• Easy “point-and-click” programming
• Remote machine control
• Remote machine maintenance
• Network and FIS capability
• TFT monitor

Optional Features: 

• In-process, closed-loop flux verification system for drop-jet control
• Full surface topside infrared preheating
• Closed-loop pyrometer control
• Board warpage sensing system
• Dual process viewing camera and second monitor
• Automatic solder wire feeding system
• Automatic solder level sensing system
• Wave height control sensing system
• Automatic solder nozzle cleaning system
• AOI solder joint inspection system
• Data logging system with traceability of all process parameters
• Barcode reader